Datasheet
LT3471
15
3471fb
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However, no responsibilit y is assumed for its use. Linear Technology Corporation makes no representa-
t i o n t h a t t h e i n t e r c o n n e c t i o n o f i t s c i r c u i t s a s d e s c r i b e d h e r e i n w i l l n o t i n f r i n g e o n e x i s t i n g p a t e n t r i g h t s .
TYPICAL APPLICATIONS
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
3.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.38 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
2.38 ±0.10
(2 SIDES)
15
106
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DD) DFN 1103
0.25 ± 0.05
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)2.15 ±0.05
0.50
BSC
0.675 ±0.05
3.50 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
Li-Ion or 4-Cell Alkaline to 3.3V and 5V SEPIC
R
SS1
4.7k
R
SS2
4.7k
3471 TA05
C
SS1
0.33μF
C
SS2
0.33μF
C1
4.7μF
V
IN
2.6V TO 6.5V
SHDN/SS1 FB1N
9
8
7
SW1
SW2
LT3471
L3
10μH
GND
FB1P
V
IN
FB2N
FB2P
V
REF
C2
0.1μF
C4
15μF
C7
56pF
C8
56pF
C3
4.7μF
C5
10μF
V
OUT1
3.3V
640mA AT V
IN
= 6.5V
550mA AT V
IN
= 5V
470mA AT V
IN
= 4V
410mA AT V
IN
= 3.3V
340mA AT V
IN
= 2.6V
V
OUT2
5V
500mA AT V
IN
= 6.5V
420mA AT V
IN
= 5V
360mA AT V
IN
= 4V
300mA AT V
IN
= 3.3V
250mA AT V
IN
= 2.6V
C1, C3, C5: X5R OR X7R 10V
C4, C6: X5R OR X7R 6.3V
D1, D2: ON SEMICONDUCTOR MBRM-120
L1-L4: MURATA LQH43CN100K032
R1
34.8k
L2
10μH
R2
15k
R3
60.4k
R4
15k
SHDN/SS2
V
IN
10
1
2
3
4
5
11 6
V
IN
C6
15μF
L1
10μH
D1
D2
L4
10μH
CONTROL 1
OV
1.8V
CONTROL 2
OV
1.8V
PACKAGE DESCRIPTION