Datasheet

10
LT3436
3436fa
Figure 6. Typical Application and Suggested Layout (Topside Only Shown)
V
OUT
INPUT
GND
C3
C1
R2 R1
L1
D1
KELVIN SENSE
V
OUT
MINIMIZE
LT3436,
C1, D1 LOOP
PLACE FEEDTHROUGHS
AROUND GROUND PIN FOR
GOOD THERMAL CONDUCTIVITY
C4
U1
SOLDER EXPOSED
GROUND PAD
TO BOARD
KEEP FB AND V
C
COMPONENTS
AWAY FROM
HIGH FREQUENCY,
HIGH INPUT
COMPONENTS
C2
LT3436
V
IN
OUTPUT
12V
0.8A
†
INPUT
5V
C2
10nF
C4
470pF
R3
4.7k
R2
10k
1%
R1
90.9k
D1
B220A
C1
22µF
CERAMIC
C3
4.7µF
CERAMIC
V
SW
FBSHDN
OPEN
OR
HIGH
= ON
GND
V
C SYNC
†
MAXIMUM OUTPUT CURRENT IS SUBJECT TO THERMAL DERATING.
L1
3.9µH
GND
R3
APPLICATIONS INFORMATION
WUU
U