Datasheet

LT3050 Series
24
3050fa
MSOP (MSE12) 0608 REV B
0.53 p 0.152
(.021 p .006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.22 –0.38
(.009 – .015)
TYP
0.86
(.034)
REF
0.650
(.0256)
BSC
12
12 11 10 9 8 7
7
DETAIL “B”
1
6
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
0.254
(.010)
0
o – 6o TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
RECOMMENDED SOLDER PAD LAYOUT
BOTTOM VIEW OF
EXPOSED PAD OPTION
2.845
p 0.102
(.112 p .004)
2.845 p 0.102
(.112 p .004)
4.039 p 0.102
(.159 p .004)
(NOTE 3)
1.651 p 0.102
(.065 p .004)
0.1016 p 0.0508
(.004 p .002)
123456
3.00 p 0.102
(.118 p .004)
(NOTE 4)
0.406 p 0.076
(.016 p .003)
REF
4.90 p 0.152
(.193 p .006)
DETAIL “B”
CORNER TAIL IS PART OF
THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
0.12 REF
0.35
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
p 0.127
(.035 p .005)
0.42 p 0.038
(.0165 p .0015)
TYP
0.65
(.0256)
BSC
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
MSE Package
12-Lead Plastic MSOP Exposed Die Pad
(Reference LTC DWG # 05-08-1666 Rev B)
PACKAGE DESCRIPTION