Datasheet

LT3032 Series
22
3032fd
PACKAGE DESCRIPTION
3.00 p0.10
(2 SIDES)
4.00 p0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.40 p 0.10
1.65 p 0.10
1.65 p 0.10
BOTTOM VIEW—EXPOSED PAD
0.75 p0.05
R = 0.115
TYP
R = 0.05
TYP
3.00 REF
17
148
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DE14MA) DFN 0507 REV A
PIN 1 NOTCH
R = 0.20 OR
0.25 s 45o
CHAMFER
3.00 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
2.10 p0.05
0.70 p0.05
3.50 p0.05
PACKAGE
OUTLINE
0.25 p 0.05
0.25 p 0.05
0.50 BSC
1.78 p0.10
0.10 TYP
0.10 TYP
1.07
p0.10
1.07
p0.05
0.51 TYP
0.50 BSC
1.78 p0.05
1.65 p 0.051.65 p 0.05
0.51 TYP
DE14MA Package
14-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1731 Rev A)
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.