Datasheet

LT3021/LT3021-1.2/
LT3021-1.5/LT3021-1.8
14
3021fc
APPLICATIONS INFORMATION
If the LT3021 is powered by a battery mounted in close
proximity on the same circuit board, a 3.3μF input capacitor
is suffi cient for stability. However, if the LT3021 is powered
by a distant supply, use a larger value input capacitor fol-
lowing the guideline of roughly 1μF (in addition to the 3.3μF
minimum) per 8 inches of wire length. As power supply
output impedance may vary, the minimum input capaci-
tance needed to stabilize the application may also vary.
Extra capacitance may also be placed directly on the output
of the power supply; however, this will require an order of
magnitude more capacitance as opposed to placing extra
capacitance in close proximity to the LT3021. Furthermore,
series resistance may be placed between the supply and
the input of the LT3021 to stabilize the application; as little
as 0.1Ω to 0.5Ω will suffi ce.
PACKAGE DESCRIPTION
DH Package
16-Lead Plastic DFN (5mm × 5mm)
(Reference LTC DWG # 05-08-1709)
5.00 ±0.10
5.00 ±0.10
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WJJD-1) IN JEDEC
PACKAGE OUTLINE MO-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
0.40 ± 0.05
BOTTOM VIEW—EXPOSED PAD
3.45 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
R = 0.20
TYP
4.10 ±0.10
(2 SIDES)
18
169
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DH16) DFN 0204
0.25 ± 0.05
PIN 1
NOTCH
0.50 BSC
4.10 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
3.45 ±0.05
(2 SIDES)
4.10 ±0.05
0.50 BSC
0.70 ±0.05
5.50 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05