Datasheet

LT3009 Series
17
3009fd
TYPICAL APPLICATIONS
IN
SHDN
3.3V
3009 TA02
OUT
1μF
1μF
GND
L
T3009-3.3
NO PROTECTION
DIODES NEEDED!
V
IN
12V
LOAD:
SYSTEM MONITOR,
VOLATILE MEMORY, ETC.
IN
SHDN
5V
3009 TA03
OUT
FAULT
1μF
SUPERCAP 1μF
SENSE
PWR
TO
MONITORING
CENTER
GND
GND
L
T3009-5
LINE POWER
V
LINE
12V TO 15V
D
CHARGE
R
LIMIT
LINE
INTERRUPT
DETECT
Keep-Alive Power Supply
Last-Gasp Circuit
0.25 ±0.05
1.42 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.61 ±0.05
(2 SIDES)
1.15 ±0.05
0.70 ±0.05
2.55 ±0.05
PACKAGE
OUTLINE
0.50 BSC
2.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WCCD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.40 ±0.10
BOTTOM VIEW—EXPOSED PAD
0.56 ±0.05
(2 SIDES)
0.75 ±0.05
R = 0.125
TYP
R = 0.05
TYP
1.37 ±0.05
(2 SIDES)
1
3
64
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DC6) DFN REV B 1309
0.25 ±0.05
0.50 BSC
PIN 1 NOTCH
R = 0.20 OR
0.25 × 45°
CHAMFER
DC6 Package
6-Lead Plastic DFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1703 Rev B)
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
PACKAGE DESCRIPTION