Datasheet

LT3009 Series
18
3009fc
DC Package
6-Lead Plastic DFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1703)
2.00 p0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WCCD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.38 p 0.05
BOTTOM VIEW—EXPOSED PAD
0.56 p 0.05
(2 SIDES)
0.75 p0.05
R = 0.115
TYP
1.37 p0.05
(2 SIDES)
1
3
64
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DC6) DFN 1103
0.25 p 0.05
1.42 p0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.61 p0.05
(2 SIDES)
1.15 p0.05
0.675 p0.05
2.50 p0.05
PACKAGE
OUTLINE
0.25 p 0.05
0.50 BSC
0.50 BSC
PIN 1
CHAMFER OF
EXPOSED PAD
PACKAGE DESCRIPTION