Datasheet

LT1976/LT1976B
27
1976bfg
PACKAGE DESCRIPTIO
U
FE Package
16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation BC
FE16 (BC) TSSOP 0204
0.09 – 0.20
(.0035 – .0079)
0° – 8°
0.25
REF
0.50 – 0.75
(.020 – .030)
4.30 – 4.50*
(.169 – .177)
134
5
6
7
8
10 9
4.90 – 5.10*
(.193 – .201)
16 1514 13 12 11
1.10
(.0433)
MAX
0.05 – 0.15
(.002 – .006)
0.65
(.0256)
BSC
2.94
(.116)
0.195 – 0.30
(.0077 – .0118)
TYP
2
RECOMMENDED SOLDER PAD LAYOUT
0.45 ±0.05
0.65 BSC
4.50 ±0.10
6.60 ±0.10
1.05 ±0.10
2.94
(.116)
3.58
(.141)
3.58
(.141)
MILLIMETERS
(INCHES)
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
SEE NOTE 4
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
6.40
(.252)
BSC
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
TYPICAL APPLICATIO
U
V
IN
SHDN
V
C
BOOST
V
BIAS
FB
PGFB
PG
LT1976B
4.7μF
100V
CER
100pF
0.33μF
0.1μF
33μH
4148
1μF
SYNC
C
T
GND
100μF
6.3V
TANT
V
OUT
3.3V
1A
V
IN
3.3V TO 60V
10MQ60N
4700pF
8.06k
16.5k
1%
10k
1%
1976 TA03
SW
C
SS
14V to 3.3V Non Burst Mode Step-Down Converter
LT1976B Efficiency and Power
Loss vs Load Current
LOAD CURRENT (mA)
0.1
EFFICIENCY (%)
POWER LOSS (W)
50
75
1000
1976 G25
25
0
1
10
100
10000
100
0.1
1
0.01
0.001
10
5V
3.3V
TYPICAL
POWER LOSS
EFFICIENCY