Datasheet

LT1962 Series
14
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applicaTions inForMaTion
Voltage and temperature coefficients are not the only
sources of problems. Some ceramic capacitors have a
piezoelectric response. A piezoelectric device generates
voltage across its terminals due to mechanical stress,
similar to the way a piezoelectric accelerometer or
microphone works
.
For a ceramic capacitor the stress can
be induced by vibrations in the system or thermal transients.
The resulting voltages produced can cause appreciable
amounts of noise, especially when a ceramic capacitor is
used for noise bypassing. A ceramic capacitor produced
Figure 6’s trace in response to light tapping from a pencil.
Similar vibration induced behavior can masquerade as
increased output voltage noise.
Thermal Considerations
The power handling capability of the device will be limited
by the maximum rated junction temperature (125°C). The
power dissipated by the device will be made up of two
components:
1. Output current multiplied by the input/output voltage
differential: (I
OUT
)(V
IN
– V
OUT
), and
2. GND pin current multiplied by the input voltage:
(I
GND
)(V
IN
).
The GND pin current can be found by examining the GND
Pin Current curves in the Typical Performance Character
-
istics section. Power dissipation will be equal to the sum
of the two components listed above.
The
LT1962 series
regulators have internal thermal
limiting designed to protect the device during overload
conditions. For continuous normal conditions, the maxi
-
mum junction temperature rating of 125°C must not be
exceeded. It is important to give careful consideration to
all
sources of thermal resistance from junction to ambi-
ent. Additional
heat sources mounted nearby must also
be considered.
For surface mount devices, heat sinking is accomplished
by using the heat spreading capabilities of the PC board
and its copper traces. Copper board stiffeners and plated
through-holes can also be used to spread the heat gener
-
ated by power devices.
The following table lists thermal resistance for several
different board sizes and copper areas. All measurements
were taken in still air on 1/16" FR-4 board with one ounce
copper.
Table 1. Measured Thermal Resistance
COPPER AREA
BOARD AREA
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)TOPSIDE* BACKSIDE
2500mm
2
2500mm
2
2500mm
2
110°C/W
1000mm
2
2500mm
2
2500mm
2
115°C/W
225mm
2
2500mm
2
2500mm
2
120°C/W
100mm
2
2500mm
2
2500mm
2
130°C/W
50mm
2
2500mm
2
2500mm
2
140°C/W
*Device is mounted on topside.
Calculating Junction Temperature
Example: Given an output voltage of 3.3V, an input volt-
age range of 4V to 6V, an output current range of 0mA
to 100mA and a maximum ambient temperature of 50°C,
what will the maximum junction temperature be?
The power dissipated by the device will be equal to:
I
OUT(MAX)
(V
IN(MAX)
– V
OUT
) + I
GND
(V
IN(MAX)
)
where,
I
OUT(MAX)
= 100mA
V
IN(MAX)
= 6V
I
GND
at (I
OUT
= 100mA, V
IN
= 6V) = 2mA
So,
P = 100mA(6V – 3.3V) + 2mA(6V) = 0.28W
The thermal resistance will be in the range of 110°C/W to
140°C/W depending on the copper area. So the junction
temperature rise above ambient will be approximately
equal to:
0.28W(125°C/W) = 35.3°C
The maximum junction temperature will then be equal to
the maximum junction temperature rise above ambient
plus the maximum ambient temperature or:
T
JMAX
= 50°C + 35.3°C = 85.3°C
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