Datasheet

LT1946A
11
sn1946a 1946afs
MSOP (MS8E) 1001
0.53 ± 0.015
(.021 ± .006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.077)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
0.13 ± 0.05
(.005 ± .002)
0.86
(.34)
REF
0.65
(.0256)
BCS
0
° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
12
3
4
4.88
± 0.1
(.192 ± .004)
8
8
1
BOTTOM VIEW OF
EXPOSED PAD OPTION
7
6
5
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
3.00 ± 0.102
(.118 ± .004)
NOTE 4
0.52
(.206)
REF
1.83 ± 0.102
(.072 ± .004)
2.06 ± 0.102
(.080 ± .004)
5.23
(.206)
MIN
3.2 – 3.45
(.126 – .136)
2.083
± 0.102
(.082 ± .004)
2.794 ± 0.102
(.110 ± .004)
0.889 ± 0.127
(.035 ± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.42 ± 0.04
(.0165 ± .0015)
TYP
0.65
(.0256)
BSC
MS8E Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1662)
V
IN
V
IN
12V ± 10%
SW
FB
3
8
1
7
4
2
65
LT1946A
L1
10µH
L2
10µH
D1
R2
9.76k
R1
84.5k
1946A TA09
C2
20µF
C3
1µF
C5
0.22µF
C4
0.22µF
C1
2.2µF
C
SS
100nF
V
OFF
–12V
10mA
A
VDD
12V
250mA
V
ON
23V
10mA
V
C
GND*
SHDN
SS
COMP
C1–C5: X5R or X7R
C1: 2.2µF, 6.3V
C2: 2× 10µF, 16V
C3: 1µF, 25V
C4: 0.22µF, 25V
C5: 0.22µF, 16V
+
D2
D3
OFF ON
D1: MICROSEMI UPS120 OR EQUIVALENT
D2–D3: CENTRAL SEMI CMDSH-3
L1–L2: TDK RLF5018-100MR94
* EXPOSED PAD MUST ALSO BE GROUNDED
Triple Output TFT Supply Uses SEPIC Topology for Output Disconnect
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
TYPICAL APPLICATIO S
U