Datasheet

LT1940/LT1940L
19
1940fa
U
PACKAGE DESCRIPTIO
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
TYPICAL APPLICATIO S
U
19V REGULATED
INPUT
BOOST2
SW2
FB2
V
C2
PG2
RUN/SS2
BOOST1
SW1
FB1
V
C1
PG1
RUN/SS1
LT1940
V
IN
GND
1940 TA08
1nF
4.7µF
0.1µF 0.1µF
20k
1.5nF
10k
10.7k
30.1k
100k
L1
15µH
L2
4.7µH
–5V
3mA
25V
3mA
5V
1.2A
D2
D7
10k
D1
D3
1nF 1nF
D4A
D4B
D5B
D6
22µF
0.022µF
10µF
10µF
1µF
+
D1, D2: ON SEMI MBRM140T3
D3: CENTRAL CMPD914
D4, D5: BAT-54S
220pF
220pF
1µF
22Ω
22Ω
22Ω
C10
1µF
13V
300mA
D5A
D6, D7: 6.2V ZENER
L1: SUMIDA CDRH4D28-4R7
L2: SUMIDA CDRH5D28-150
TFT LCD Supply
FE Package
16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation BA
FE16 (BA) TSSOP 0203
0.09 – 0.20
(.0036 – .0079)
0
° – 8°
0.45 – 0.75
(.018 – .030)
4.30 – 4.50*
(.169 – .177)
6.40
BSC
134
5
6
7
8
10 9
4.90 – 5.10*
(.193 – .201)
16 1514 13 12 11
1.10
(.0433)
MAX
0.05 – 0.15
(.002 – .006)
0.65
(.0256)
BSC
2.74
(.108)
2.74
(.108)
0.195 – 0.30
(.0077 – .0118)
2
MILLIMETERS
(INCHES)
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
RECOMMENDED SOLDER PAD LAYOUT
3. DRAWING NOT TO SCALE
0.45 ±0.05
0.65 BSC
4.50 ±0.10
6.60 ±0.10
1.05 ±0.10
2.74
(.108)
2.74
(.108)
SEE NOTE 4
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT