Datasheet

11
LT1937
1937f
U
PACKAGE DESCRIPTIO
S5 Package
5-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1635)
SC6 Package
6-Lead Plastic SC70
(Reference LTC DWG # 05-08-1638)
1.50 – 1.75
(NOTE 4)
2.80 BSC
0.30 – 0.45 TYP
5 PLCS (NOTE 3)
DATUM ‘A’
0.09 – 0.20
(NOTE 3)
S5 TSOT-23 0302
PIN ONE
2.90 BSC
(NOTE 4)
0.95 BSC
1.90 BSC
0.80 – 0.90
1.00 MAX
0.01 – 0.10
0.20 BSC
0.30 – 0.50 REF
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
3.85 MAX
0.62
MAX
0.95
REF
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
1.4 MIN
2.62 REF
1.22 REF
1.15 – 1.35
(NOTE 4)
1.80 – 2.40
0.15 – 0.30
6 PLCS (NOTE 3)
0.10 – 0.18
(NOTE 3)
SC6 SC70 0302
1.80 – 2.20
(NOTE 4)
0.65 BSC
PIN 1
0.80 – 1.00
1.00 MAX
0.00 – 0.10
0.10 – 0.40
0.10 – 0.30
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. DETAILS OF THE PIN 1 INDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE INDEX AREA
7. EIAJ PACKAGE REFERENCE IS EIAJ SC-70
3.26 MAX
0.47
MAX
0.65
REF
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.96 MIN
2.1 REF
1.16 REF
INDEX AREA
(NOTE 6)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.