Datasheet

LT1880
11
1880fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
SIMPLIFIED SCHEMATIC
PACKAGE DESCRIPTION
1880 SD
Q59
Q48
Q16
Q58
Q3
Q41
Q38
C
B
A
B
A
5
1
4
3
2
Q44
V
+
V
–
Q1 Q2 Q45
Q46
Q47
Q4
Q6
Q5
Q12
Q14
Q20
Q24Q23
R3 R4
R27
R5
R38
100μA
35μA
21μA
7μA 10μA
RCM2
RCM1
R1
500Ω
R2
500Ω
R22
500Ω
CM1
CM2
CM3
+IN
–IN
OUT
CX1
V
–
Q7
Q8
1.50 – 1.75
(NOTE 4)
2.80 BSC
0.30 – 0.45 TYP
5 PLCS (NOTE 3)
DATUM ‘A’
0.09 – 0.20
(NOTE 3)
S5 TSOT-23 0302 REV B
PIN ONE
2.90 BSC
(NOTE 4)
0.95 BSC
1.90 BSC
0.80 – 0.90
1.00 MAX
0.01 – 0.10
0.20 BSC
0.30 – 0.50 REF
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
3.85 MAX
0.62
MAX
0.95
REF
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
1.4 MIN
2.62 REF
1.22 REF
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
S5 Package
5-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1635)