Datasheet

LT1766/LT1766-5
28
1766fc
PACKAGE DESCRIPTION
FE Package
16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation BB
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
FE16 (BB) TSSOP 0204
0.09 – 0.20
(.0035 – .0079)
0o – 8o
0.25
REF
0.50 – 0.75
(.020 – .030)
4.30 – 4.50*
(.169 – .177)
1.10
(.0433)
MAX
0.05 – 0.15
(.002 – .006)
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
MILLIMETERS
(INCHES)
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
RECOMMENDED SOLDER PAD LAYOUT
0.45 p0.05
0.65 BSC
4.50 p0.10
6.60 p0.10
1.05 p0.10
2.94
(.116)
3.58
(.141)
SEE NOTE 4
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
134
5
6
7
8
10 9
4.90 – 5.10*
(.193 – .201)
16 1514 13 12 11
2.94
(.116)
2
3.58
(.141)
6.40
(.252)
BSC
GN16 (SSOP) 0204
.016 – .050
(0.406 – 1.270)
.015
p .004
(0.38 p 0.10)
s
45
o
0
o
– 8
o
TYP
.007 – .0098
(0.178 – 0.249)
.0532 – .0688
(1.35 – 1.75)
.008 – .012
(0.203 – 0.305)
TYP
.004 – .0098
(0.102 – 0.249)
.0250
(0.635)
BSC
12
3
4
5
6
7
8
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
16
15
14
13
.189 – .196*
(4.801 – 4.978)
12 11 10
9
.009
(0.229)
REF
.254 MIN
RECOMMENDED SOLDER PAD LAYOUT
.150 – .165
.0250 BSC.0165
p
.0015
.045
p
.005
* DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
** DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
INCHES
(MILLIMETERS)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE