Datasheet

19
LT1764A Series
1764afb
PACKAGE DESCRIPTION
U
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
T Package
5-Lead Plastic TO-220 (Standard)
(Reference LTC DWG # 05-08-1421)
T5 (TO-220) 0399
0.028 – 0.038
(0.711 – 0.965)
0.067
(1.70)
0.135 – 0.165
(3.429 – 4.191)
0.700 – 0.728
(17.78 – 18.491)
0.045 – 0.055
(1.143 – 1.397)
0.095 – 0.115
(2.413 – 2.921)
0.013 – 0.023
(0.330 – 0.584)
0.620
(15.75)
TYP
0.155 – 0.195*
(3.937 – 4.953)
0.152 – 0.202
(3.861 – 5.131)
0.260 – 0.320
(6.60 – 8.13)
0.165 – 0.180
(4.191 – 4.572)
0.147 – 0.155
(3.734 – 3.937)
DIA
0.390 – 0.415
(9.906 – 10.541)
0.330 – 0.370
(8.382 – 9.398)
0.460 – 0.500
(11.684 – 12.700)
0.570 – 0.620
(14.478 – 15.748)
0.230 – 0.270
(5.842 – 6.858)
BSC
SEATING PLANE
* MEASURED AT THE SEATING PLANE
FE Package
16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation BB
FE16 (BB) TSSOP 0204
0.09 – 0.20
(.0035 – .0079)
0° – 8°
0.25
REF
0.50 – 0.75
(.020 – .030)
4.30 – 4.50*
(.169 – .177)
134
5
6
7
8
10 9
4.90 – 5.10*
(.193 – .201)
16 1514 13 12 11
1.10
(.0433)
MAX
0.05 – 0.15
(.002 – .006)
0.65
(.0256)
BSC
2.94
(.116)
0.195 – 0.30
(.0077 – .0118)
TYP
2
RECOMMENDED SOLDER PAD LAYOUT
0.45 ±0.05
0.65 BSC
4.50 ±0.10
6.60 ±0.10
1.05 ±0.10
2.94
(.116)
3.58
(.141)
3.58
(.141)
MILLIMETERS
(INCHES)
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
SEE NOTE 4
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
6.40
(.252)
BSC