Datasheet
15
LT1676
TYPICAL APPLICATIONS
U
V
IN
C1
NC
Q1
PN2484
Q2
2N2369
1676 F08
V
+
1
2
3
5
4
V
IN
V
–
U3
7S02
INA
+
INB
–
U2
LTC1442
REF
HYST
OUTA
OUTB
+
C2
+
D1
R1
39k
V
OUT
5V
R2
10k
R5
22k
R6
2.4M
L1
R3
323k
1%
R4
100k
1%
R8
6.8M
R9
240k
C3
R7
10M
C1: PANASONIC HFQ 39µF AT 63V
C2: AVX D CASE 100µF 10V
TPSD107M010R0080
D1: MOTOROLA 100V, 1A,
SMD SCHOTTKY
MBRS1100 (T3)
L1: COILCRAFT DO3316-224
V
IN
V
CC
V
SW
U1
LT1676
FB
V
C
SHDN
SYNC
2
5
4
3
7
8
6
1
GND
Figure 8. Burst Mode Operation Configuration with Micropower UVLO
PACKAGE DESCRIPTION
U
Dimensions in inches (millimeters) unless otherwise noted.
N8 Package
8-Lead PDIP (Narrow 0.300)
(LTC DWG # 05-08-1510)
0.009 – 0.015
(0.229 – 0.381)
0.300 – 0.325
(7.620 – 8.255)
0.325
+0.035
–0.015
+0.889
–0.381
8.255
()
N8 1197
0.100 ± 0.010
(2.540 ± 0.254)
0.065
(1.651)
TYP
0.045 – 0.065
(1.143 – 1.651)
0.130 ± 0.005
(3.302 ± 0.127)
0.020
(0.508)
MIN
0.018 ± 0.003
(0.457 ± 0.076)
0.125
(3.175)
MIN
12
3
4
876
5
0.255 ± 0.015*
(6.477 ± 0.381)
0.400*
(10.160)
MAX
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 INCH (0.254mm)
SO8 0996
0.016 – 0.050
0.406 – 1.270
0.010 – 0.020
(0.254 – 0.508)
×
45
°
0
°
– 8
°
TYP
0.008 – 0.010
(0.203 – 0.254)
0.053 – 0.069
(1.346 – 1.752)
0.014 – 0.019
(0.355 – 0.483)
0.004 – 0.010
(0.101 – 0.254)
0.050
(1.270)
TYP
1
2
3
4
0.150 – 0.157**
(3.810 – 3.988)
8
7
6
5
0.189 – 0.197*
(4.801 – 5.004)
0.228 – 0.244
(5.791 – 6.197)
DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
*
**
S8 Package
8-Lead Plastic Small Outline (Narrow 0.150)
(LTC DWG # 05-08-1610)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.