Datasheet
11
LT1310
sn1310 1310fs
U
PACKAGE DESCRIPTIO
MSE Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1663)
Layout Hints
The high speed operation of the LT1310 demands careful
attention to board layout. You will not get advertised
performance with careless layout. Figure 6 shows the
recommended component placement for a boost
converter.
LT1310
R2
R
LP
SHDN
SYNC
C
LP
GND
C
OUT
D1
1310 F06
L1
SW
MULTIPLE VIAS
V
OUT
V
IN
C
IN
R1
R
C
C
T
C
C
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
MSOP (MSE) 0802
0.53 ± 0.01
(.021 ± .006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 – 0.27
(.007 – .011)
TYP
0.13 ± 0.076
(.005 ± .003)
0.86
(.034)
REF
0.50
(.0197)
BSC
12
3
45
4.90 ± 0.15
(1.93 ± .006)
0.497 ± 0.076
(.0196 ± .003)
REF
8910
7
6
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
3.00 ± 0.102
(.118 ± .004)
NOTE 4
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010)
0
° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.2 – 3.45
(.126 – .136)
0.889
± 0.127
(.035 ± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.305 ± 0.038
(.0120 ± .0015)
TYP
2.083 ± 0.102
(.082 ± .004)
2.794 ± 0.102
(.110 ± .004)
0.50
(.0197)
BSC
10
1
BOTTOM VIEW OF
EXPOSED PAD OPTION
1.83
± 0.102
(.072 ± .004)
2.06 ± 0.102
(.081 ± .004)
APPLICATIO S I FOR ATIO
WUUU
Figure 6. Recommended Component Placement for Boost Converter. Note Direct High Current Paths Using Wide PC Traces. Minimize
Trace Area at Pin 10 (V
C
), Pin 9 (C
T
) and Pin 1 (FB). Use Multiple Vias to Tie Pin 5 Copper and the Exposed Pad to Ground Plane. Use
Vias at One Location Only to Avoid Introducing Switching Currents Into the Ground Plane