Datasheet

18
LT1307/LT1307B
1307fa
Single Cell CCFL Power Supply
V
IN
V
C
D1
100Ω
43
CCFL
2
1.5V
5
T1
1
1307 TA08
610
SW
FB
0.1µF
C1
0.1µF
1
CELL
1.5V
1.5V
1k
L1
33µH
LT1307B
1 = OPERATE
0 = SHUTDOWN
C1: WIMA MKP-20
D1: MOTOROLA MBR0520L
L1: SUMIDA CD54-330
T1: COILTRONICS CTX110611
Q1, Q2: ZETEX FZT-849
GND
SHDN
10k
DIMMING
0.1µF
1N4148
1N4148
1µF
CERAMIC
10k
47pF
3kV
Q1 Q2
TYPICAL APPLICATIO S
U
U
PACKAGE DESCRIPTIO
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660)
MSOP (MS8) 1001
0.53 ± 0.015
(.021 ± .006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.077)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
0.13 ± 0.05
(.005 ± .002)
0.86
(.34)
REF
0.65
(.0256)
BCS
0° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
12
3
4
4.88 ± 0.1
(.192 ± .004)
8
7
6
5
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
3.00 ± 0.102
(.118 ± .004)
NOTE 4
0.52
(.206)
REF
5.23
(.206)
MIN
3.2 – 3.45
(.126 – .136)
0.889
± 0.127
(.035 ± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.42 ± 0.04
(.0165 ± .0015)
TYP
0.65
(.0256)
BSC