Datasheet

11
LT1208/LT1209
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
U
PACKAGE
D
E
SC
R
I
PTI
O
Dimensions in inches (millimeters) unless otherwise noted.
N Package
14-Lead Plastic DIP
N14 0392
0.015
(0.380)
MIN
0.125
(3.175)
MIN
0.130 ± 0.005
(3.302 ± 0.127)
0.045 – 0.065
(1.143 – 1.651)
0.065
(1.651)
TYP
0.018 ± 0.003
(0.457 ± 0.076)
0.100 ± 0.010
(2.540 ± 0.254)
0.075 ± 0.015
(1.905 ± 0.381)
0.260 ± 0.010
(6.604 ± 0.254)
0.770
(19.558)
MAX
31
2
4
5
6
7
8910
11
1213
14
0.009 – 0.015
(0.229 – 0.381)
0.300 – 0.325
(7.620 – 8.255)
0.325
+0.025
–0.015
+0.635
–0.381
8.255
()
0.010 – 0.020
(0.254 – 0.508)
0.016 – 0.050
0.406 – 1.270
× 45°
0° – 8° TYP
0.008 – 0.010
(0.203 – 0.254)
1
2
3
4
5
6
7
8
0.150 – 0.157*
(3.810 – 3.988)
16
15
14
13
0.386 – 0.394*
(9.804 – 10.008)
0.228 – 0.244
(5.791 – 6.197)
12
11 10
9
SO16 0392
0.053 – 0.069
(1.346 – 1.752)
0.014 – 0.019
(0.355 – 0.483)
0.004 – 0.010
(0.101 – 0.254)
0.050
(1.270)
TYP
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 INCH (0.15mm).
S Package
16-Lead Plastic SOIC