Datasheet

LT1206
11
1206fa
APPLICATIONS INFORMATION
When the LT1206 is used to drive capacitive loads, the
available output current can limit the overall slew rate. In the
fastest confi guration, the LT1206 is capable of a slew rate
of over 1V/ns. The current required to slew a capacitor at
this rate is 1mA per picofarad of capacitance, so 10,000pF
would require 10A! The photo (Figure 6) shows the large
signal behavior with C
L
= 10,000pF. The slew rate is about
60V/µs, determined by the current limit of 600mA.
the maximum allowable input voltage. To allow for some
margin, it is recommended that the input signal be less
than ±5V when the device is shut down.
Capacitance on the Inverting Input
Current feedback amplifi ers require resistive feedback from
the output to the inverting input for stable operation. Take
care to minimize the stray capacitance between the output
and the inverting input. Capacitance on the inverting input
to ground will cause peaking in the frequency response
(and overshoot in the transient response), but it does not
degrade the stability of the amplifi er.
Power Supplies
The LT1206 will operate from single or split supplies from
±5V (10V total) to ±15V (30V total). It is not necessary to
use equal value split supplies, however the offset voltage
and inverting input bias current will change. The offset
voltage changes about 500µV per volt of supply mismatch.
The inverting bias current can change as much as 5µA
per volt of supply mismatch, though typically the change
is less than 0.5µA per volt.
Thermal Considerations
The LT1206 contains a thermal shutdown feature which
protects against excessive internal (junction) temperature.
If the junction temperature of the device exceeds the pro-
tection threshold, the device will begin cycling between
normal operation and an off state. The cycling is not
harmful to the part. The thermal cycling occurs at a slow
rate, typically 10ms to several seconds, which depends
on the power dissipation and the thermal time constants
of the package and heat sinking. Raising the ambient
temperature until the device begins thermal shutdown
gives a good indication of how much margin there is in
the thermal design.
For surface mount devices heat sinking is accomplished
by using the heat spreading capabilities of the PC board
and its copper traces. Experiments have shown that the
heat spreading copper layer does not need to be electri-
cally connected to the tab of the device. The PCB material
can be very effective at transmitting heat between the pad
area attached to the tab of the device, and a ground or
R
F
= 750Ω
R
L
= 50Ω
20ns/DIV
1206 F05c
Figure 5c. Large-Signal Response, A
V
= 2
Differential Input Signal Swing
The differential input swing is limited to about ±6V by
an ESD protection device connected between the inputs.
In normal operation, the differential voltage between the
input pins is small, so this clamp has no effect; however,
in the shutdown mode the differential swing can be the
same as the input swing. The clamp voltage will then set
V
S
= ±15V
R
L
= R
G
= 3k
R
L
= ∞
500ns/DIV
1206 TA02
Figure 6. Large-Signal Response, C
L
= 10,000pF