Datasheet

LT1129/LT1129-3.3/LT1129-5
15
112935ff
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
ST Package
3-Lead Plastic SOT-223
(LTC DWG # 05-08-1630)
S8 Package
8-Lead Plastic Small Outline (Narrow 0.150)
(LTC DWG # 05-08-1610)
.114 – .124
(2.90 – 3.15)
.248 – .264
(6.30 – 6.71)
.130 – .146
(3.30 – 3.71)
.264 – .287
(6.70 – 7.30)
.0905
(2.30)
BSC
.033 – .041
(0.84 – 1.04)
.181
(4.60)
BSC
.024 – .033
(0.60 – 0.84)
.071
(1.80)
MAX
10°
MAX
.012
(0.31)
MIN
.0008 – .0040
(0.0203 – 0.1016)
10° – 16°
.010 – .014
(0.25 – 0.36)
10° – 16°
RECOMMENDED SOLDER PAD LAYOUT
ST3 (SOT-233) 0502
.129 MAX
.059 MAX
.059 MAX
.181 MAX
.039 MAX
.248 BSC
.090
BSC
.016 – .050
(0.406 – 1.270)
.010 – .020
(0.254 – 0.508)
s 45°
0°– 8° TYP
.008 – .010
(0.203 – 0.254)
SO8 0303
.053 – .069
(1.346 – 1.752)
.014 – .019
(0.355 – 0.483)
TYP
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
1
2
3
4
.150 – .157
(3.810 – 3.988)
NOTE 3
8
7
6
5
.189 – .197
(4.801 – 5.004)
NOTE 3
.228 – .244
(5.791 – 6.197)
.245
MIN
.160 ±.005
RECOMMENDED SOLDER PAD LAYOUT
.045 ±.005
.050 BSC
.030 ±.005
TYP
INCHES
(MILLIMETERS)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
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