Datasheet

11
LT1117/LT1117-2.85
LT1117-3.3/LT1117-5
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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High Efficiency Regulator
LT1117 • TA18
UW
ETHODS
SOLDERI G
The SOT-223 is manufactured with gull wing leadform for
surface mount applications. The leads and heatsink are
solder plated and allow easy soldering using non-active or
mildly active fluxes. The package is constructed with three
leads exiting one side of the package and one heatsink
exiting the other side, and the die attached to the heatsink
internally.
The recommended methods of soldering SOT-223 are:
vapor phase reflow and infrared reflow with preheat of
component to within 65°C of the solder temperature.
Hand soldering and wave soldering are not recom-
mended since these methods can easily damage the
part with excessive thermal gradients across the pack-
age.
Care must be exercised during surface mount to minimize
large (> 30°C per second) thermal shock to the package.
2k
OUTPUT
ADJUST
240Ω
100µF
+
470Ω
1N914
4N28
–
+
1N914
1k
+
MR1122
10k
28V INPUT
1mH
10,000µF
1M
10k
10k
LT1011
LT1117 • TA15
28V
OUTPUT
28V
LT1117
IN
ADJ
OUT