Datasheet

11
LT1083/LT1084/LT1085 Fixed
1083ffd
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
U
PACKAGE DESCRIPTIO
P Package
3-Lead Plastic TO-3P (Similar to TO-247)
(LTC DWG # 05-08-1450)
.170
(4.32)
MAX
.325
(8.255)
.580
(14.732)
.560
(14.224)
.170 – .2OO
(4.32 – 5.08)
MOUNTING HOLE
.115 – .145
(2.92 – 3.68)
DIA
.580 – .6OO
(14.73 – 15.24)
.830 – .870
(21.08 – 22.10)
.780 – .800
(19.81 – 20.32)
.620 – .64O
(15.75 – 16.26)
.215
(5.46)
BSC
.113 – .123
(2.87 – 3.12)
.042 – .052
(1.07 – 1.32)
.074 – .084
(1.88 – 2.13)
.187 – .207
(4.75 – 5.26)
.060 – .080
(1.52 – 2.03)
18° – 22°
3° – 7°
.087 – .102
(2.21 – 2.59)
.020 – .040
(0.51 – 1.02)
EJECTOR PIN MARKS
.105 – .125
(2.67 – 3.18)
DIA
P3 0801
.098
(2.489)
.124
(3.149)
.700
(17.780)
.275
(6.985)
BOTTOM VIEW OF TO-3P
HATCHED AREA IS SOLDER PLATED
COPPER HEAT SINK
M Package
3-Lead Plastic DD Pak
(LTC DWG # 05-08-1460)
.050
(1.270)
.143
+.012
–.020
()
3.632
+0.305
–0.508
.100
(2.54)
BSC
.013 – .023
(0.330 – 0.584)
.095 – .115
(2.413 – 2.921)
.004
+.008
–.004
()
0.102
+0.203
–0.102
.050
± .012
(1.270 ± 0.305)
.059
(1.499)
.045 – .055
(1.143 – 1.397)
.165 – .180
(4.191 – 4.572)
.330 – .370
(8.382 – 9.398)
.060
(1.524)
TYP
.390 – .415
(9.906 – 10.541)
15
°
.300
(7.620)
.075
(1.905)
.183
(4.648)
.060
(1.524)
.060
(1.524)
.256
(6.502)
BOTTOM VIEW OF DD PAK
HATCHED AREA IS SOLDER PLATED
COPPER HEAT SINK
M (DD3) 0204
.420
.350
.565
.090
.070
.100
.420
.276
.325
.205
.080
.565
.090
.070
.100
RECOMMENDED SOLDER PAD LAYOUT
FOR THICKER SOLDER PASTE APPLICATIONS
RECOMMENDED SOLDER PAD LAYOUT
NOTE:
1. DIMENSIONS IN INCH/(MILLIMETER)
2. DRAWING NOT TO SCALE
.320