Datasheet

11
LT1082
sn1082 1082fas
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
U
PACKAGE
D
E
SC
R
I
PTI
O
N8 1098
0.100
(2.54)
BSC
0.065
(1.651)
TYP
0.045 – 0.065
(1.143 – 1.651)
0.130 ± 0.005
(3.302 ± 0.127)
0.020
(0.508)
MIN
0.018 ± 0.003
(0.457 ± 0.076)
0.125
(3.175)
MIN
12
3
4
876
5
0.255 ± 0.015*
(6.477 ± 0.381)
0.400*
(10.160)
MAX
0.009 – 0.015
(0.229 – 0.381)
0.300 – 0.325
(7.620 – 8.255)
0.325
+0.035
–0.015
+0.889
–0.381
8.255
()
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 INCH (0.254mm)
N8 Package
8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510)
Q Package
5-Lead Plastic DD Pak
(Reference LTC DWG # 05-08-1461)
Q(DD5) 0502
.028 – .038
(0.711 – 0.965)
TYP
.143
+.012
–.020
()
3.632
+0.305
–0.508
.067
(1.702)
BSC
.013 – .023
(0.330 – 0.584)
.095 – .115
(2.413 – 2.921)
.004
+.008
–.004
()
0.102
+0.203
–0.102
.050
± .012
(1.270 ± 0.305)
.059
(1.499)
TYP
.045 – .055
(1.143 – 1.397)
.165 – .180
(4.191 – 4.572)
.330 – .370
(8.382 – 9.398)
.060
(1.524)
TYP
.390 – .415
(9.906 – 10.541)
15
° TYP
.420
.350
.565
.090
.042
.067
RECOMMENDED SOLDER PAD LAYOUT
.325
.205
.080
.565
.090
RECOMMENDED SOLDER PAD LAYOUT
FOR THICKER SOLDER PASTE APPLICATIONS
.042
.067
.420
.276
.320
NOTE:
1. DIMENSIONS IN INCH/(MILLIMETER)
2. DRAWING NOT TO SCALE
.300
(7.620)
.075
(1.905)
.183
(4.648)
.060
(1.524)
.060
(1.524)
.256
(6.502)
BOTTOM VIEW OF DD PAK
HATCHED AREA IS SOLDER PLATED
COPPER HEAT SINK