Datasheet

18
LT1078/LT1079
10789fe
OBSOLETE PACKAGE
SCHEMATIC
WW
SI PLIFIED
1/2 LT1078, 1/4 LT1079
10k 10k 2.2k 5.6k
Q5
Q6
Q11
600Ω
600Ω
Q1
Q21
Q2
Q22
Q9
C2
175pF
6.2k
Q7
Q28
4
1
Q12
Q3
Q16 Q14
Q29
Q4
Q24
8.6k
C1
50pF
C5
2.5pF
Q27
V
+
Q10
Q17
Q8
6.2k
Q19
Q18
Q15 Q32
1.3k
3.6k
Q37
Q30
1
3
Q25
C4
4pF
2.9k
3k
Q31
C3
40pF
Q23
Q20
1.35k
30Ω
Q34
Q36
OUT
Q26
30Ω
Q35
5k
Q54
1
1
2
150k
Q33
10k
V
+
Q38
5.35k
Q45
Q55
Q51
Q42
Q44
V
+
V
–
Q46
Q47
11.5k
V
+
12.5k
Q40
Q41
Q48
9.1k
Q43
V
–
700k
700k
LT1078/79 • SIMPLIFIED SCHEM
IN
–
IN
+
Q50
Q49
J1
Q39
Q53
Q52
H8 (TO-5) 0.230 PCD 1197
0.050
(1.270)
MAX
0.016 – 0.021**
(0.406 – 0.533)
0.010 – 0.045*
(0.254 – 1.143)
SEATING
PLANE
0.040
(1.016)
MAX
0.165 – 0.185
(4.191 – 4.699)
GAUGE
PLANE
REFERENCE
PLANE
0.500 – 0.750
(12.700 – 19.050)
0.305 – 0.335
(7.747 – 8.509)
0.335 – 0.370
(8.509 – 9.398)
DIA
LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND 0.045" BELOW THE REFERENCE PLANE
FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS
0.016 – 0.024
(0.406 – 0.610)
*
**
0.230
(5.842)
TYP
0.027 – 0.045
(0.686 – 1.143)
0.028 – 0.034
(0.711 – 0.864)
0.110 – 0.160
(2.794 – 4.064)
INSULATING
STANDOFF
45°TYP
PIN 1
H Package
8-Lead TO-5 Metal Can (.230 Inch PCD)
(Reference LTC DWG # 05-08-1321)
PACKAGE DESCRIPTIO
U