Datasheet

11
LT1025
1025fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
U
PACKAGE DESCRIPTIO
N8 Package
8-Lead PDIP (Narrow 0.300)
(LTC DWG # 05-08-1510)
N8 1002
.065
(1.651)
TYP
.045 – .065
(1.143 – 1.651)
.130 ± .005
(3.302 ± 0.127)
.020
(0.508)
MIN
.018 ± .003
(0.457 ± 0.076)
.120
(3.048)
MIN
12
3
4
876
5
.255 ± .015*
(6.477 ± 0.381)
.400*
(10.160)
MAX
.008 – .015
(0.203 – 0.381)
.300 – .325
(7.620 – 8.255)
.325
+.035
–.015
+0.889
–0.381
8.255
()
NOTE:
1. DIMENSIONS ARE
INCHES
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
.100
(2.54)
BSC
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)
.016 – .050
(0.406 – 1.270)
.010 – .020
(0.254 – 0.508)
× 45°
0°– 8° TYP
.008 – .010
(0.203 – 0.254)
SO8 0303
.053 – .069
(1.346 – 1.752)
.014 – .019
(0.355 – 0.483)
TYP
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
1
2
3
4
.150 – .157
(3.810 – 3.988)
NOTE 3
8
7
6
5
.189 – .197
(4.801 – 5.004)
NOTE 3
.228 – .244
(5.791 – 6.197)
.245
MIN
.160
±
.005
RECOMMENDED SOLDER PAD LAYOUT
.045
±
.005
.050 BSC
.030
±
.005
TYP
INCHES
(MILLIMETERS)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)