Datasheet

11
LT1022
1022fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
U
PACKAGE DESCRIPTIO
H Package
8-Lead TO-5 Metal Can (.200 Inch PCD)
(Reference LTC DWG # 05-08-1320)
0.050
(1.270)
MAX
0.016 – 0.021**
(0.406 – 0.533)
0.010 – 0.045*
(0.254 – 1.143)
SEATING
PLANE
0.040
(1.016)
MAX
0.165 – 0.185
(4.191 – 4.699)
GAUGE
PLANE
REFERENCE
PLANE
0.500 – 0.750
(12.700 – 19.050)
0.305 – 0.335
(7.747 – 8.509)
0.335 – 0.370
(8.509 – 9.398)
DIA
0.200
(5.080)
TYP
0.027 – 0.045
(0.686 – 1.143)
0.028 – 0.034
(0.711 – 0.864)
0.110 – 0.160
(2.794 – 4.064)
INSULATING
STANDOFF
45°TYP
H8(TO-5) 0.200 PCD 1197
LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND 0.045" BELOW THE REFERENCE PLANE
FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS
0.016 – 0.024
(0.406 – 0.610)
*
**
PIN 1
OBSOLETE PACKAGE