Datasheet

15
LT1021
1021fc
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
U
N8 1002
.065
(1.651)
TYP
.045 – .065
(1.143 – 1.651)
.130 ± .005
(3.302 ± 0.127)
.020
(0.508)
MIN
.018 ± .003
(0.457 ± 0.076)
.120
(3.048)
MIN
12
3
4
87 6
5
.255 ± .015*
(6.477 ± 0.381)
.400*
(10.160)
MAX
.008 – .015
(0.203 – 0.381)
.300 – .325
(7.620 – 8.255)
.325
+.035
–.015
+0.889
–0.381
8.255
()
NOTE:
1. DIMENSIONS ARE
INCHES
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
.100
(2.54)
BSC
.050
(1.270)
MAX
.016 – .021**
(0.406 – 0.533)
.010 – .045*
(0.254 – 1.143)
SEATING
PLANE
.040
(1.016)
MAX
.165 – .185
(4.191 – 4.699)
GAUGE
PLANE
REFERENCE
PLANE
.500 – .750
(12.700 – 19.050)
.305 – .335
(7.747 – 8.509)
.335 – .370
(8.509 – 9.398)
DIA
.200
(5.080)
TYP
.027 – .045
(0.686 – 1.143)
.028 – .034
(0.711 – 0.864)
.110 – .160
(2.794 – 4.064)
INSULATING
STANDOFF
45°
H8(TO-5) 0.200 PCD 0204
LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND THE SEATING PLANE
FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS
.016 – .024
(0.406 – 0.610)
*
**
PIN 1
H Package
8-Lead TO-5 Metal Can (.200 Inch PCD)
(Reference LTC DWG # 05-08-1320)
N8 Package
8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510)