Datasheet

15
LT1020
sn1020 1020fcs
U
PACKAGE DESCRIPTIO
J Package
14-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110)
N Package
14-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510)
J14 0801
.045 – .065
(1.143 – 1.651)
.100
(2.54)
BSC
.014 – .026
(0.360 – 0.660)
.200
(5.080)
MAX
.015 – .060
(0.381 – 1.524)
.125
(3.175)
MIN
.300 BSC
(7.62 BSC)
.008 – .018
(0.203 – 0.457)
0° – 15°
1
234
56
7
.220 – .310
(5.588 – 7.874)
.785
(19.939)
MAX
.005
(0.127)
MIN
14
11 891013
12
.025
(0.635)
RAD TYP
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE
OR TIN PLATE LEADS
N14 1002
.020
(0.508)
MIN
.120
(3.048)
MIN
.130 ± .005
(3.302 ± 0.127)
.045 – .065
(1.143 – 1.651)
.065
(1.651)
TYP
.018 ± .003
(0.457 ± 0.076)
.005
(0.125)
MIN
.255 ± .015*
(6.477 ± 0.381)
.770*
(19.558)
MAX
31
2
4
5
6
7
8910
11
1213
14
.008 – .015
(0.203 – 0.381)
.300 – .325
(7.620 – 8.255)
.325
+.035
–.015
+0.889
–0.381
8.255
()
NOTE:
1. DIMENSIONS ARE
INCHES
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
.100
(2.54)
BSC
OBSOLETE PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.