Datasheet

14
LT1011/LT1011A
PACKAGE DESCRIPTION
U
Dimensions in inches (millimeters) unless otherwise noted.
H8 (TO-5) 0.230 PCD 1197
0.050
(1.270)
MAX
0.016 – 0.021**
(0.406 – 0.533)
0.010 – 0.045*
(0.254 – 1.143)
SEATING
PLANE
0.040
(1.016)
MAX
0.165 – 0.185
(4.191 – 4.699)
GAUGE
PLANE
REFERENCE
PLANE
0.500 – 0.750
(12.700 – 19.050)
0.305 – 0.335
(7.747 – 8.509)
0.335 – 0.370
(8.509 – 9.398)
DIA
LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND 0.045" BELOW THE REFERENCE PLANE
FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS
0.016 – 0.024
(0.406 – 0.610)
*
**
0.230
(5.842)
TYP
0.027 – 0.045
(0.686 – 1.143)
0.028 – 0.034
(0.711 – 0.864)
0.110 – 0.160
(2.794 – 4.064)
INSULATING
STANDOFF
45°TYP
PIN 1
SCHE ATIC DIAGRA
WW
R1
1.3k
OFFSET
R4
300Ω
Q5
D1 D2
R3
300Ω
R23
4k
R17
200Ω
R2
1.3k
R5
160Ω
R27
3k
R8
800Ω
R9
800Ω
R10
4k
R11
170Ω
R12
470Ω
R24
400Ω
R13
4Ω
R6
3.2k
R7
3.2k
Q3
Q28
Q30
Q4
D5
Q1
Q2
Q8
Q9 Q19
Q20
Q10
Q11
Q7
5
OFFSET/STROBE
6
V
+
8
7
1
D4
D6
Q29
Q31
Q6
INPUT
(+)
Q27
Q25
Q26
Q21
Q22
D3
R21
960Ω
R14
4.8k
R15
700Ω
R16
800Ω
R18
275Ω
R19
500Ω
R26
1.6k
R25
1.6k
Q23
D7
2
INPUT
(–)
3
Q18
Q24
Q17
V
–
R20
940Ω
R22
200Ω
Q16
4
Q13
Q15
OUTPUT
GND
1011 SD
Q12
Q14
H Package
8-Lead TO-5 Metal Can (.230 Inch PCD)
(Reference LTC DWG # 05-08-1321)
OBSOLETE PACKAGE