Datasheet

LTC2205-14

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APPLICATIONS INFORMATION

Grounding and Bypassing

The LTC2205-14 requires a printed circuit board with a

clean unbroken ground plane; a multilayer board with an

internal ground plane is recommended. The pinout of the

LTC2205-14 has been optimized for a ﬂ owthrough layout

so that the interaction between inputs and digital outputs

is minimized. Layout for the printed circuit board should

ensure that digital and analog signal lines are separated as

much as possible. In particular, care should be taken not

to run any digital track alongside an analog signal track

or underneath the ADC.

High quality ceramic bypass capacitors should be used

at the V

DD,

, and OV

pins. Bypass capacitors must

be located as close to the pins as possible. The traces

connecting the pins and bypass capacitors must be kept

short and should be made as wide as possible.

The LTC2205-14 differential inputs should run parallel

and close to each other. The input traces should be as

short as possible to minimize capacitance and to minimize

noise pickup.

Heat Transfer

Most of the heat generated by the LTC2205-14 is transferred

from the die through the bottom-side exposed pad. For

good electrical and thermal performance, the exposed

pad must be soldered to a large grounded pad on the PC

board. It is critical that the exposed pad and all ground

pins are connected to a ground plane of sufﬁ cient area

with as many vias as possible.