Datasheet
LTM4624
20
4624fb
For more information www.linear.com/LTM4624
APPLICATIONS INFORMATION
Figure 19. Recommended PCB Layout
V
IN
C
OUT
V
OUT
4624 F19
GND
C
IN
R
FB
Safety Considerations
The LTM4624 modules do not provide galvanic isolation
from V
IN
to V
OUT
. There is no internal fuse. If required,
a slow blow fuse with a rating twice the maximum input
current needs to be provided to protect each unit from
catastrophic failure. The device does support thermal
shutdown and over current protection.
Layout Checklist/Example
The high integration of LTM4624 makes the PCB board
layout very simple and easy. However, to optimize its electri
-
cal and thermal performance, some layout considerations
are still necessar
y
.
• Use large PCB copper areas for high current paths,
including V
IN
, GND and V
OUT
. It helps to minimize the
PCB conduction loss and thermal stress.
• Place high frequency ceramic input and output capaci-
tors next to the V
IN
, PGND and V
OUT
pins to minimize
high frequency noise.
• Place a dedicated power ground layer underneath the
unit.
• To minimize the via conduction loss and reduce module
thermal stress, use multiple vias for interconnection
between top layer and other power layers.
• Do not put via directly on the pad, unless they are
capped or plated over.
• Use a separated SGND ground copper area for com
-
ponents connected to signal pins. Connect the SGND
to GND underneath the unit.
•
Bring out test points on the signal pins for monitoring.
Figure 19 gives a good example of the recommended layout.