Datasheet

LTM9011-14/
LTM9010-14/LTM9009-14
32
9009101114fa
applicaTions inForMaTion
HEAT TRANSFER
Most of the heat generated by the LTM9011-14/LTM9010-14/
LTM9009-14 is transferred from the die through the bot-
tom of the package onto the printed circuit board. The
ground pins should be connected to the internal ground
planes by multiple vias.
Table 5. Internal Trace Lengths
PIN NAME
LENGTH
(mm) PIN NAME
LENGTH
(mm) PIN NAME
LENGTH
(mm) PIN NAME
LENGTH
(mm)
E7 01A
–
1.775 K8 05B
–
0.379 E1 A
IN3
–
2.491 F10 DCOB
–
1.811
E8 01A
+
1.947 K7 05B
+
0.528 E2 A
IN3
+
2.505 F9 DCOB
+
1.812
C8 01B
–
1.847 K9 06A
–
1.866 G1 A
IN4
–
3.376 H7 FRA
–
1.117
D8 01B
+
1.850 K10 06A
+
1.865 G2 A
IN4
+
3.372 H8 FRA
+
1.038
B8 02A
–
3.233 L9 06B
–
2.268 H2 A
IN5
–
3.301 J9 FRB
–
1.644
A8 02A
+
3.246 L10 06B
+
2.267 H1 A
IN5
+
3.346 J10 FRB
+
1.643
D7 02B
–
0.179 M7 07A
–
1.089 K2 A
IN6
–
2.506 A7 PAR/SER 3.838
C7 02B
+
1.127 L7 07A
+
0.179 K1 A
IN6
+
2.533 L6 SCK 0.240
D10 03A
–
2.126 P8 07B
–
3.281 M2 A
IN7
–
3.198 E6 SDOA 0.453
D9 03A
+
2.177 N8 07B
+
3.149 M1 A
IN7
+
3.214 D6 SDOB 0.274
E10 03B
–
1.811 L8 08A
–
1.862 N2 A
IN8
–
4.726 M6 SDI 1.069
E9 03B
+
1.812 M8 08A
+
1.847 N1 A
IN8
+
4.691 B3 V
CM12
3.914
C9 04A
–
3.199 M10 08B
–
4.021 P6 CLK
–
4.106 F3 V
CM34
0.123
C10 04A
+
3.196 M9 08B
+
4.016 P5 CLK
+
4.106 J3 V
CM56
0.079
F7 04B
–
0.706 B1 A
IN1
–
4.689 L5 CSA 0.919 N3 V
CM78
3.915
F8 04B
+
0.639 B2 A
IN1
+
4.709 M5 CSB 1.162
J8 05A
–
0.392 C1 A
IN2
–
4.724 G8 DCOA
–
1.157
J7 05A
+
0.436 C2 A
IN2
+
4.769 G7 DCOA
+
1.088
Table 5 lists the trace lengths for the analog inputs and
digital outputs inside the package from the die pad to the
package pad. These should be added to the PCB trace
lengths for best matching.
The material used for the substrate is BT (bismaleimide-
triazine), supplied by Mitsubishi Gas and Chemical. In
the DC to 125MHz range, the speed for the analog input
signals is 198ps/in or 7.795ps/mm. The speed for the
digital outputs is 188.5ps/in or 7.417ps/mm.