Datasheet
LTM4637
28
4637fc
For more information www.linear.com/LTM4637
pacKage DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
3
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
PACKAGE TOP VIEW
4
PIN “A1”
CORNER
X
Y
aaa Z
aaa Z
PACKAGE BOTTOM VIEW
PIN 1
3
SEE NOTES
SUGGESTED PCB LAYOUT
TOP VIEW
BGA 133 0213 REV Ø
LTMXXXXXX
µModule
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
COMPONENT
PIN “A1”
DETAIL A
0.0000
0.0000
DETAIL A
Øb (133 PLACES)
DETAIL B
SUBSTRATE
0.27 – 0.37
3.95 – 4.05
// bbb Z
D
A
A1
b1
ccc Z
DETAIL B
PACKAGE SIDE VIEW
MOLD
CAP
Z
M
X YZddd
M
Zeee
0.630 ±0.025 Ø 133x
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
aaa
bbb
ccc
ddd
eee
MIN
4.72
0.50
4.22
0.60
0.60
NOM
4.92
0.60
4.32
0.75
0.63
15.0
15.0
1.27
13.97
13.97
MAX
5.12
0.70
4.42
0.90
0.66
0.15
0.10
0.20
0.30
0.15
NOTES
DIMENSIONS
TOTAL NUMBER OF BALLS: 133
E
b
e
e
b
A2
F
G
BGA Package
133-Lead (15mm × 15mm × 4.92mm)
(Reference LTC DWG # 05-08-1940 Rev Ø)
0.6350
0.6350
1.9050
1.9050
3.1750
3.1750
4.4450
4.4450
5.7150
5.7150
6.9850
6.9850
6.9850
5.7150
5.7150
4.4450
4.4450
3.1750
3.1750
1.9050
1.9050
0.6350
0.6350
6.9850
FGHM L JK E ABCD
2
1
4
3
5
6
7
12
8
9
10
11
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
7 PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
!
7
SEE NOTES
8.42
BSC
3.29
BSC
3.54
BSC
2.18
BSC