Datasheet

LTC2380-16
24
238016fa
PACKAGE DESCRIPTION
MS Package
16-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1669 Rev Ø)
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889 p 0.127
(.035 p .005)
RECOMMENDED SOLDER PAD LAYOUT
0.305 p 0.038
(.0120 p .0015)
TYP
0.50
(.0197)
BSC
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
MSOP (MS16) 1107 REV Ø
0.53 p 0.152
(.021
p .006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 –0.27
(.007 – .011)
TYP
0.86
(.034)
REF
0.50
(.0197)
BSC
1615 141312 1110
12345678
9
0.254
(.010)
0o – 6o TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
4.039 p 0.102
(.159
p .004)
(NOTE 3)
0.1016 p 0.0508
(.004
p .002)
3.00 p 0.102
(.118
p .004)
(NOTE 4)
0.280 p 0.076
(.011
p .003)
REF
4.90 p 0.152
(.193
p .006)
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.