Datasheet

LTM4613
27
4613f
PACKAGE DESCRIPTION
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
DETAIL B
DETAIL B
SUBSTRATE
MOLD
CAP
// bbb Z
Z
A
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS LAND DESIGNATION PER JESD MO-222, SPP-010 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. THE TOTAL NUMBER OF PADS: 133
4 3
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE
PACKAGE TOP VIEW
4
PAD “A1”
CORNER
X
Y
aaa Z
aaa Z
PACKAGE BOTTOM VIEW
3
SEE NOTES
SUGGESTED PCB LAYOUT
TOP VIEW
DETAIL A
F G H L M J K E A B C D
2 14 312 11 9 510 678
D
0.630 ±0.025 Ø 133x
E
b
e
e
b
F
G
LGA 133 0610 REV Ø
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
COMPONENT
PIN “A1”
SYMBOL
A
b
D
E
e F
G
H1 H2
aaa
bbb
eee
MIN
4.22 0.60 0.27 3.95
NOM
4.32 0.63 15.0 15.0 1.27
13.97 13.97
0.32 4.00
MAX
4.42 0.66 0.37 4.05 0.15 0.10 0.05
NOTES
DIMENSIONS
TOTAL NUMBER OF LGA PADS: 133
LTMXXXXXX
µModule
H2
H1
DETAIL A
0.630 ±0.025 SQ. 133x
S
YXeee
C(0.30) PAD 1
6.9850 6.9850 5.7150 5.7150 4.4450 4.4450 3.1750 3.1750 1.9050 1.9050 0.6350 0.6350
0.0000
6.9850
6.9850
5.7150
5.7150
4.4450
4.4450
3.1750
3.1750
1.9050
1.9050
0.6350
0.6350
0.0000
LGA Package
133-Lead (15mm × 15mm × 4.32mm)
(Reference LTC DWG # 05-08-1884 Rev Ø)