Datasheet

LTC4370
15
4370f
PCB Layout Considerations
Kelvin connection of the OUT pins to the sense resis-
tors is important for accurate current sharing. Place the
MOSFET as close as possible to the sense resistor. Keep the
traces to the MOSFET wide and short to minimize resistive
losses. The PCB traces associated with the power path
through the MOSFET should have low resistance. Thermal
management techniques such as sufficient drain cop-
per area or heat sinks should be considered for optimal
MOSFET power dissipation. See Figure 7.
It is also important to put C
VCC
, the bypass capacitor, as
close as possible between V
CC
and GND. Place C1 and
C2 near the CPO and V
IN
pins. The COMP pin may need
a guard ring to maintain low board leakage.
Figure 7. Recommended PCB Layout for M1, M2, C
VCC
, R1, R2
applicaTions inForMaTion
4370 FO7
MSOP-16
R1
G
S
W
TO
LOAD
CURRENT FLOW
CURRENT FLOW
VIA TO
GROUND
PLANE
D
M2
DD-PAK
FROM
SUPPLY
B
G
S
C
VCC
W D
M1
DD-PAK
FROM
SUPPLY
A
R2
TRACK WIDTH
W: 0.03 PER AMPERE
ON 1oz Cu FOIL
DRAWING IS NOT TO SCALE!
LTC4370