Datasheet

LTM4627
21
4627fc
For more information www.linear.com/LTM4627
Table 2. 1.2V Output
DERATING
CURVE V
IN
POWER LOSS
CURVE
AIRFLOW
(LFM) HEAT SINK θ
JA
(°C/W)*
Figures 9, 11 5V, 12V Figure 7 0 None 13
Figures 9, 11 5V, 12V Figure 7 200 None 11
Figures 9, 11 5V, 12V Figure 7 400 None 8
Figures 10, 12 5V, 12V Figure 7 0 BGA Heat Sink 12
Figures 10, 12 5V, 12V Figure 7 200 BGA Heat Sink 8
Figures 10, 12 5V, 12V Figure 7 400 BGA Heat Sink 7
Table 3. 3.3V Output
DERATING
CURVE V
IN
POWER LOSS
CURVE
AIRFLOW
(LFM) HEAT SINK θ
JA
(°C/W)*
Figures 13, 15 5V, 12V Figure 8 0 None 13
Figures 13, 15 5V, 12V Figure 8 200 None 11
Figures 13, 15 5V, 12V Figure 8 400 None 8
Figures 14, 16 5V, 12V Figure 8 0 BGA Heat Sink 12
Figures 14, 16 5V, 12V Figure 8 200 BGA Heat Sink 8
Figures 14, 16 5V, 12V Figure 8 400 BGA Heat Sink 7
* θ
JA
derived from laboratory measurements using a 95mm × 76mm PCB with 4 layers. Two outer
layers are 2oz copper and two inner layers are 1oz copper. PCB thickness is 1.6mm. BGA heat sink
references are listed in Table 4.
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