Datasheet

LTM4628
34
4628fe
For more information www.linear.com/LTM4628
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS BALL DESIGNATION PER JESD MS-028 AND JEP95 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
4 3
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE
PACKAGE TOP VIEW
4
PIN “A1”
CORNER
X
Y
aaa Z
aaa Z
PACKAGE BOTTOM VIEW
PIN 1
3
SEE NOTES
SUGGESTED PCB LAYOUT
TOP VIEW
BGA 144 1112 REV A
LTMXXXXXX
µModule
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
COMPONENT
PIN “A1”
DETAIL A
0.0000
0.0000
DETAIL A
Øb (144 PLACES)
D
A
DETAIL B
PACKAGE SIDE VIEW
Z
M
X YZddd
M
Zeee
0.630 ±0.025 Ø 144x
E
b
e
e
b
A2
F
G
BGA Package
144-Lead (15mm × 15mm × 4.92mm)
(Reference LTC DWG # 05-08-1921 Rev A)
0.6350 0.6350 1.9050 1.9050 3.1750 3.1750 4.4450 4.4450 5.7150 5.7150 6.9850
6.9850
6.9850
5.7150
5.7150
4.4450
4.4450
3.1750
3.1750
1.9050
1.9050
0.6350
0.6350
6.9850
DETAIL B
SUBSTRATE
A1
b1
ccc Z
MOLD
CAP
SYMBOL
A
A1 A2
b
b1
D
E
e F
G
H1 H2
aaa
bbb
ccc
ddd
eee
MIN
4.72 0.50 4.22 0.60 0.60 0.27 3.95
NOM
4.92 0.60 4.32 0.75 0.63
15.00 15.00
1.27
13.97 13.97
0.32 4.00
MAX
5.12 0.70 4.42 0.90 0.66 0.37 4.05 0.15 0.10 0.20 0.30 0.15
NOTES
DIMENSIONS
TOTAL NUMBER OF BALLS: 144
// bbb Z
Z
H2
H1
0.0
F G H M L J K E A B C D
2 14 356712 891011
7 PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY
!
7
SEE NOTES