Datasheet

LTM8033
23
8033fa
For more information www.linear.com/LTM8033
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS LAND DESIGNATION PER JESD MO-222 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. THE TOTAL NUMBER OF PADS: 76
4 3
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE
DETAIL B
DETAIL B
SUBSTRATE
MOLD
CAP
0.270 – 0.370
3.95 – 4.05
bbb Z
Z
PACKAGE TOP VIEW
11.25
BSC
15.00
BSC
4
PAD “A1”
CORNER
X
Y
aaa Z
aaa Z
PACKAGE BOTTOM VIEW
3
PADS SEE NOTES
SUGGESTED PCB LAYOUT
TOP VIEW
LGA 76 1212 REV A
LTMXXXXXX
µModule
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
COMPONENT
PIN “A1”
8.89
BSC
1.27
BSC
PAD 1
0.635
0.635
1.905
1.905
3.175
3.175
4.445
4.445
6.350 5.080 3.810 3.810 5.080 6.350 2.540 2.540 1.270 1.270 0.000
SYMBOL
aaa
bbb
eee
TOLERANCE
0.15 0.10 0.05
DETAIL A
0.635 ±0.025 75SQ
S
YXeee
DETAIL C
0.635 ±0.025 75SQ
S
YXeee
F G H L J K E A B C D
2 14 3567
4.22 – 4.42
DETAIL A
12.70
BSC
8
DETAIL C
LGA Package
76-Lead (15mm × 11.25mm × 4.32mm)
(Reference LTC DWG # 05-08-1560 Rev A)
7 PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY
!
7
SEE NOTES
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.