Datasheet

LTM8033
2
8033fa
For more information www.linear.com/LTM8033
PIN CONFIGURATION
ABSOLUTE MAXIMUM RATINGS
V
IN
, FIN, RUN/SS Voltage ........................................36V
ADJ, RT, SHARE Voltage ............................................ 6V
V
OUT
, AUX ................................................................25V
PGOOD, SYNC ..........................................................30V
(Note 1)
LGA PACKAGE
76-LEAD (15mm × 11.25mm × 4.32mm)
TOP VIEW
F G H LJ KEA B C D
2
1
4
3
5
6
7
8
BIAS
RUN/SS
AUX
PGOOD
RT
ADJ
SYNC
GND
SHARE
BANK 4
BANK 3 FIN
BANK 2
GND
V
IN
BANK 1
V
OUT
T
JMAX
= 125°C, θ
JA
= 15.4°C/W, θ
JCbottom
= 5.2°C/W, θ
JB
= 9.8°C/W, θ
JCtop
= 16.7°C/W
θ VALUES DERIVED FROM A 4 LAYER 6.35cm × 6.35cm PCB
WEIGHT = 2.2g
BGA PACKAGE
76-LEAD (15mm × 11.25mm × 4.92mm)
TOP VIEW
F G H LJ KEA B C D
2
1
4
3
5
6
7
8
BIAS
RUN/SS
AUX
PGOOD
RT
ADJ
SYNC
GND
SHARE
BANK 4
BANK 3 FIN
BANK 2
GND
V
IN
BANK 1
V
OUT
T
JMAX
= 125°C, θ
JA
= 15.4°C/W, θ
JCbottom
= 5.2°C/W, θ
JB
= 9.8°C/W, θ
JCtop
= 16.7°C/W
θ VALUES DERIVED FROM A 4 LAYER 6.35cm × 6.35cm PCB
WEIGHT = 2.2g
BIAS ......................................................................... 25V
Maximum Junction Temperature (Note 2) .......... 125°C
Solder Temperature ............................................. 245°C
PART NUMBER PAD OR BALL FINISH
PART MARKING*
PACKAGE
TYPE
MSL
RATING
TEMPERATURE RANGE
(Note 2)DEVICE FINISH CODE
LTM8033EV#PBF Au (RoHS) LTM8033V e4 LGA 3 –40°C to 125°C
LTM8033IV#PBF Au (RoHS) LTM8033V e4 LGA 3 –40°C to 125°C
LTM8033MPV#PBF Au (RoHS) LTM8033V e4 LGA 3 –55°C to 125°C
LTM8033EY#PBF SAC305 (RoHS) LTM8033Y e1 BGA 3 –40°C to 125°C
LTM8033IY#PBF SAC305 (RoHS) LTM8033Y e1 BGA 3 –40°C to 125°C
LTM8033IY SnPb (63/67) LTM8033Y e0 BGA 3 –40°C to 125°C
LTM8033MPY#PBF SAC305 (RoHS) LTM8033Y e1 BGA 3 –55°C to 125°C
LTM8033MPY SnPb (63/67) LTM8033Y e0 BGA 3 –55°C to 125°C
Consult Marketing for parts specified with wider operating temperature
ranges. *Device temperature grade is indicated by a label on the shipping
container. Pad or ball finish code is per IPC/JEDEC J-STD-609.
• Terminal Finish Part Marking:
www.linear.com/leadfree
• Recommended LGA and BGA PCB Assembly and Manufacturing
Procedures:
www.linear.com/umodule/pcbassembly
• LGA and BGA Package and Tray Drawings:
www
.linear.com/packaging
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