Datasheet

LTC4070
14
4070fc
package DescripTion
MS8E Package
8-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1662 Rev E)
MSOP (MS8E) 0908 REV E
0.53 ± 0.152
(.021 ± .006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.86
(.034)
REF
0.65
(.0256)
BSC
0° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
1 2
3
4
4.90 ± 0.152
(.193 ± .006)
8
8
1
BOTTOM VIEW OF
EXPOSED PAD OPTION
7
6
5
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
0.52
(.0205)
REF
1.83 ± 0.102
(.072 ± .004)
2.06 ± 0.102
(.081 ± .004)
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
2.083 ± 0.102
(.082 ± .004)
2.794 ± 0.102
(.110 ± .004)
0.889 ± 0.127
(.035 ± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.42 ± 0.038
(.0165 ± .0015)
TYP
0.65
(.0256)
BSC
0.1016 ± 0.0508
(.004 ± .002)
MS8E Package
8-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1662 Rev E)
DETAIL “B”
DETAIL “B”
CORNER TAIL IS PART OF
THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
0.05 REF
0.29
REF