Datasheet

LTM8048
2
8048ff
For more information www.linear.com/LTM8048
PIN CONFIGURATIONABSOLUTE MAXIMUM RATINGS
V
IN
, RUN, BIAS ........................................................32V
ADJ1, SS .....................................................................5V
V
OUT1
Relative to V
OUT
–
............................................16V
(V
IN
– GND) + (V
OUT1
– V
OUT
–
) .................................36V
V
OUT2
Relative to V
OUT
–
..........................................+20V
ADJ2 Relative to V
OUT
–
.............................................+7V
BYP Relative to V
OUT
–
............................................+0.6V
BIAS Above V
IN
........................................................ 0.1V
GND to V
OUT
–
Isolation (Note 2) ........................725VDC
Maximum Internal Temperature (Note 3) .............. 125°C
Maximum Solder Temperature .............................. 250°C
Storage Temperature.............................. –55°C to 125°C
(Note 1)
TOP VIEW
H
G
F
E
D
C
B
A
1 2 3 4 5 6 7
BANK 2
V
OUT
–
BANK 1
V
OUT1
BANK 4
GND
BIAS
RUN
ADJ2
BYP
ADJ1
SS
BANK 5
V
IN
BANK 3
V
OUT2
BGA PACKAGE
45-LEAD (11.25mm × 9mm × 4.92mm)
T
JMAX
= 125°C, θ
JA
= 23.2°C/W, θ
JCbottom
= 5.8°C/W, θ
JCtop
= 23.2°C/W, θ
JB
= 6.7°C/W
WEIGHT = 1.1g, θ VALUES DETERMINED PER JEDEC 51-9, 51-12
ORDER INFORMATION
PART NUMBER
PAD OR BALL
FINISH
PART MARKING*
PACKAGE TYPE MSL RATING TEMPERATURE RANGE (NOTE 3) DEVICE FINISH CODE
LTM8048EY#PBF SAC305 (RoHS) LTM8048Y e1 BGA 3 –40°C to 125°C
LTM8048IY#PBF SAC305 (RoHS) LTM8048Y e1 BGA 3 –40°C to 125°C
LTM8048IY SnPb (63/37) LTM8048Y e0 BGA 3 –40°C to 125°C
LTM8048MPY#PBF SAC305 (RoHS) LTM8048Y e1 BGA 3 –55°C to 125°C
LTM8048MPY SnPb (63/37) LTM8048Y e0 BGA 3 –55°C to 125°C
Consult Marketing for parts specified with wider operating temperature
ranges. *Device temperature grade is indicated by a label on the shipping
container. Pad or ball finish code is per IPC/JEDEC J-STD-609.
• Pb-free & Non-Pb-free Part Markings:
www.linear.com/leadfree
•
Recommended LGA and BGA PCB Assembly and Manufacturing
Procedures:
www.linear.com/umodule/pcbassembly
•
BGA Package and Tray Drawings:
www.linear.com/packaging/