Datasheet

LTM2882
19
2882fd
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
revision hisTory
REV DATE DESCRIPTION PAGE NUMBER
A 3/10 Changes to Features
Add BGA Package to Pin Configuration, Order Information and Package Description Sections
Changes to LGA Package in Pin Configuration Section
Update to Pin Functions
Update to RF, Magnetic Field Immunity Section
“PCB Layout Isolation Considerations” Section Replaced
1
2, 15
2
9
12
13
B 3/11 H-Grade parts added. Reflected throughout the data sheet. 1-20
C 1/12 MP-Grade parts added. Reflected throughout the data sheet. 1-24
D 11/12 Storage temperature range updated. 2