Datasheet

LTM2881
22
2881ff
For more information www.linear.com/2881
package DescripTion
LGA Package
32-Lead (15mm × 11.25mm × 2.8mm)
(Reference LTC DWG # 05-08-1773 Rev q)
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS LAND DESIGNATION PER JESD MO-222 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. THE TOTAL NUMBER OF PADS: 32
4 3
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE
DETAIL B
DETAIL B
SUBSTRATE
MOLD
CAP
0.290 – 0.350
2.400 – 2.600
bbb Z
Z
PACKAGE TOP VIEW
11.25
BSC
15.00
BSC
4
PAD “A1”
CORNER
X
Y
aaa Z
aaa Z
PACKAGE BOTTOM VIEW
3
PADS SEE NOTES
SUGGESTED PCB LAYOUT
TOP VIEW
LGA 32 0308 REV Ø
LTMXXXXXX
µModule
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
COMPONENT
PIN “A1”
8.89
BSC
1.27
BSC
PAD 1
0.635
0.635
1.905
1.905
3.175
3.175
4.445
4.445
6.350 6.350 5.080 5.080 0.000
SYMBOL
aaa
bbb
eee
TOLERANCE
0.10 0.10 0.05
DETAIL A
0.630 ±0.025 Ø 32x
S
YXeee
DETAIL C
0.630 ±0.025 Ø 32x
S
YXeee
F G H L J K E A B C D
2 14 3567
2.69 – 2.95
DETAIL A
12.70
BSC
8
DETAIL c
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.