Datasheet

LTC2757
19
2757f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
LX Package
48-Lead Plastic LQFP (7mm × 7mm)
(Reference LTC DWG # 05-08-1760 Rev Ø)
LX48 LQFP 0907 REVØ
0° – 7°
11° – 13°
0.45 – 0.75
1.00 REF
11° – 13°
9.00 BSC
AA
7.00 BSC
1
2
7.00 BSC
9.00 BSC
48
1.60
MAX
1.35 – 1.45
0.05 – 0.150.09 – 0.20
0.50
BSC
0.17 – 0.27
GAUGE PLANE
0.25
NOTE:
1. PACKAGE DIMENSIONS CONFORM TO JEDEC #MS-026 PACKAGE OUTLINE
2. DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.25mm ON ANY SIDE, IF PRESENT
4. PIN-1 INDENTIFIER IS A MOLDED INDENTATION, 0.50mm DIAMETER
5. DRAWING IS NOT TO SCALE
SEE NOTE: 4
C0.30 – 0.50
R0.08 – 0.20
7.15 – 7.25
5.50 REF
1
2
5.50 REF
7.15 – 7.25
48
PACKAGE OUTLINE
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
SECTION A – A
0.50 BSC
0.20 – 0.30
1.30 MIN