Datasheet
LTM4601AHV
15
4601ahvfc
For more information www.linear.com/LTM4601AHV
Figure 7. 1.5V Output Power Loss
Figure 9. No Heat Sink 5V
IN
Figure 10. BGA Heat Sink 5V
IN
Figure 8. 3.3V Output Power Loss
applicaTions inForMaTion
LOAD CURRENT (A)
0
0
POWER LOSS (W)
1.0
2.0
3.0
2
4
6 8
4601AHV F07
10
4.0
5.0
0.5
1.5
2.5
3.5
4.5
12
24V
IN
12V
IN
5V
IN
LOAD CURRENT (A)
0
0
POWER LOSS (W)
1
2
3
4
6
2
4 6 8
4601AHV F08
10
12
5
24V
IN
12V
IN
AMBIENT TEMPERATURE (°C)
50
0
MAXIMUM LOAD CURRENT (A)
2
4
6
8
10
12
60 70 80 90
4601AHV F09
100
5V
IN
, 1.5V
OUT
0LFM
5V
IN
, 1.5V
OUT
200LFM
5V
IN
, 1.5V
OUT
400LFM
AMBIENT TEMPERATURE (°C)
50
0
MAXIMUM LOAD CURRENT (A)
2
4
6
8
10
12
60 70 80 90
4601AHV F10
100
5V
IN
, 1.5V
OUT
0LFM
5V
IN
, 1.5V
OUT
200LFM
5V
IN
, 1.5V
OUT
400LFM
Thermal Considerations and Output Current Derating
The power loss curves in Figures 7 and 8 can be used
in coordination with the load current derating curves in
Figures 9 to 16 for calculating an approximate θ
JA
for the
module with various heat sinking methods. Thermal models
are derived from several temperature measurements at the
bench and thermal modeling analysis. Thermal Application
Note 103 provides a detailed explanation of the analysis for
the thermal models and the derating curves. Tables 3 and 4
provide a summary of the equivalent θ
JA
for the noted
conditions. These equivalent θ
JA
parameters are correlated
to the measured values, and are improved with air flow.
The case temperature is maintained at 100°C or below
for the derating curves. The maximum case temperature
of 100°C is to allow for a rise of about 13°C to 25°C in
-
side the µModule regulator with a thermal resistance θ
JC
from junction to case between 6°C/W to 9°C/W. This will
maintain the maximum junction temperature inside the
device below 125°C.