Datasheet

LTM8032
23
8032fg
For more information www.linear.com/LTM8032
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
PACKAGE TOP VIEW
4
PIN “A1”
CORNER
Y
X
aaa Z
aaa Z
DETAIL A
PACKAGE BOTTOM VIEW
3
SEE NOTES
L
K
J
H
G
F
E
D
C
B
A
1234567
PIN 1
BGA 71 1212 REV A
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
COMPONENT
PIN “A1”
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
3
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
DETAIL A
Øb (71 PLACES)
DETAIL B
SUBSTRATE
A
A1
b1
ccc Z
DETAIL B
PACKAGE SIDE VIEW
MOLD
CAP
Z
M
X YZddd
M
Zeee
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
MIN
3.22
0.50
2.72
0.71
0.60
0.27
2.45
NOM
3.42
0.60
2.82
0.78
0.63
15.0
9.0
1.27
12.7
7.62
0.32
2.50
MAX
3.62
0.70
2.92
0.85
0.66
0.37
2.55
0.15
0.10
0.20
0.30
0.15
NOTES
DIMENSIONS
TOTAL NUMBER OF BALLS: 71
A2
D
E
e
e
b
F
G
SUGGESTED PCB LAYOUT
TOP VIEW
0.000
1.270
6.350
2.540
3.810
5.080
6.350
1.270
2.540
3.810
5.080
3.810 2.540 1.270 3.810 2.540 1.270 0.3175 0.3175
0.000
4.765
5.395
LTMXXXXXX
µModule
// bbb Z
Z
H2
H1
b
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION CAN BE 96.5% Sn/3.0% Ag/0.5% Cu
OR Sn Pb EUTECTIC
0.630 ±0.025 Ø 71x
BGA Package
71-Lead (15mm × 9.00mm × 3.42mm)
(Reference LTC DWG # 05-08-1885 Rev A)
7 PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
!
7
SEE NOTES