Datasheet

LTM8032
22
8032fg
For more information www.linear.com/LTM8032
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
9.00
BSC
PACKAGE TOP VIEW
LGA 71 1212 REV A
15.00
BSC
4
PAD 1
CORNER
3
PADS
SEE NOTES
X
Y
aaa Z
aaa Z
2.670 – 2.970
DETAIL A
PACKAGE SIDE VIEW
DETAIL A
SUBSTRATE
MOLD
CAP
0.27 – 0.37
2.40 – 2.60
bbb Z
Z
1.270
BSC
0.635 ±0.025 SQ. 71x
12.700
BSC
7.620
BSC
PAD 1
Ø (0.635)
PACKAGE IN TRAY LOADING ORIENTATION
2.540
2.540
1.270
5.080
5.080
6.350
6.350
3.810
3.810
0.000
1.270
3.810 3.810 2.540 2.540 1.270 1.270 0.000
SUGGESTED PCB LAYOUT
TOP VIEW
LTMXXXXXX
µModule
TRAY PIN 1
BEVEL
COMPONENT
PIN 1
PACKAGE BOTTOM VIEW
67 5 1234
L
K
J
H
G
F
E
D
C
B
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
LAND DESIGNATION PER JESD MO-222, SPP-010 AND SPP-020
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. THE TOTAL NUMBER OF PADS: 71
4
3
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
DETAIL A
S
YXeee
DETAIL A
SYMBOL
aaa
bbb
eee
TOLERANCE
0.15
0.10
0.05
1.27
BSC
LGA Package
71-Lead (15mm × 9mm × 2.82mm)
(Reference LTC DWG # 05-08-1823 Rev A)
7 PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
!
7
SEE NOTES