Datasheet

LTM8032
2
8032fg
For more information www.linear.com/LTM8032
V
IN
, FIN, RUN/SS Voltage .........................................40V
ADJ, RT, SHARE Voltage ............................................. 5V
V
OUT
, AUX ................................................................. 10V
Current from AUX ................................................100mA
(Note 1)
GND
1
A
B
C
BANK 1
BANK 2
BANK 3
D
E
F
G
H
J
K
L
2 3 4
TOP VIEW
LGA PACKAGE
71-LEAD (9mm × 15mm × 2.82mm)
5 6 7
V
OUT
V
IN
RT
SHARE
ADJ
PGOOD
SYNCRUN/SS
FIN
BIAS
AUX
T
JMAX
= 125°C, θ
JA
= 25.2°C/W, θ
JCbottom
= 10.3°C/W,
θ
JCtop
= 15.8°C/W, θ
JB
= 11.4°C/W, WEIGHT = 1.2g
θ
VALUES DETERMINED PER JESD51-9
GND
1
A
B
C
BANK 1
BANK 2
BANK 3
D
E
F
G
H
J
K
L
2 3 4
TOP VIEW
BGA PACKAGE
71-LEAD (9mm × 15mm × 3.42mm)
5 6 7
V
OUT
V
IN
RT
SHARE
ADJ
PGOOD
SYNCRUN/SS
FIN
BIAS
AUX
T
JMAX
= 125°C, θ
JA
= 25.6°C/W, θ
JCbottom
= 11.0°C/W,
θ
JCtop
= 15.8°C/W, θ
JB
= 11.4°C/W, WEIGHT = 1.2g
θ
VALUES DETERMINED PER JEDEC 51-9, 51-12
pin conFiguraTion
absoluTe MaxiMuM raTings
PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE
TYPE
MSL
RA
TING
TEMPERATURE RANGE
(Note 2)
DEVICE CODE
LTM8032EV#PBF Au (RoHS) LTM8032V e4 LGA 3 –40°C to 125°C
LTM8032IV#PBF Au (RoHS) LTM8032V e4 LGA 3 –40°C to 125°C
LTM8032MPV#PBF Au (RoHS) LTM8032MPV e4 LGA 3 –55°C to 125°C
LTM8032EY#PBF SAC305 (RoHS) LTM8032Y e1 BGA 3 –40°C to 125°C
LTM8032IY#PBF SAC305 (RoHS) LTM8032Y e1 BGA 3 –40°C to 125°C
LTM8032MPY#PBF SAC305 (RoHS) LTM8032Y e1 BGA 3 –55°C to 125°C
LTM8032MPY SnPb (63/37) LTM8032Y e0 BGA 3 –55°C to 125°C
orDer inForMaTion
PGOOD, SYNC...........................................................30V
BIAS .......................................................................... 25V
V
IN
+ BIAS ................................................................. 56V
Maximum Junction Temperature (Note 2) ............ 125°C
Solder Temperature ............................................... 245°C
Consult Marketing for parts specified with wider operating temperature
ranges. *Device temperature grade is indicated by a label on the shipping
container. Pad or ball finish code is per IPC/JEDEC J-STD-609.
• Pb-free and Non-Pb-free Part Markings:
www.linear.com/leadfree
• Recommended LGA and BGA PCB Assembly and Manufacturing
Procedures:
www.linear.com/umodule/pcbassembly
• LGA and BGA Package and T
ray Drawings:
www.linear.com/packaging